Rohm & Haas Electronic Materials CMP Holdings Inc. filed a civil action with the Intellectual Property Court against NexPlanar Corporation and Wah Lee Industrial Corp. alleging that NexPlanar Corporation’s polishing pads infringed upon Rohm & Haas’s Taiwan patent no. 165490.  The first instance of the Intellectual Property Court rendered a decision on May 20, 2014 to dismiss the action filed by Rohm & Haas against NexPlanar Corporation and Wah Lee Industrial Corp. on the grounds that the polishing pad does not infringe upon the asserted claims of the plaintiff’s patent.

Jeanne Wang