Between January 1 and June 30, 2016, a total of 34,494 (-2.55%) patent applications were filed with the TIPO, of which 20,622 (-2.17%) applications were for invention patents, 9,927 (-6.23%) for utility model patents, and 3,945 (+5.74%) for design patents.
In terms of applications by country, 7,447 (-6.84%) invention patent applications were filed by domestic applicants, and 13,175 (+0.69%) were filed by foreign applicants. There were 9,346 (-10.91%) utility model patent applications filed by domestic applicants, and 555 (-13.69%) were filed by foreign applicants. As for design patent, 2,192 (+8.03%) applications were filed by domestic applicants, and 1,825 (+15.95%) were filed by foreign applicants.
The top three domestic applicants filing the most patent applications are: Hon Hai Precision Industry Company Limited (176), AU Optronics Corporation (133) and Acer Incorporated (109). The top foreign applicants filing the most applications are Intel Corporation (U.S.) (375), Qualcomm Incorporated (U.S.) (313) and Semiconductor Energy Laboratory Co., Ltd. (JP) (204).
In the first half of 2016, domestic enterprises filed 5,144 invention patent applications (-8.16%), domestic colleges filed 776 applications (+9.56%), and domestic research institutes filed 259 applications (+7.17%). There were 1,268 invention patent applications filed by domestic individual applicants (+0.96%).
In addition, a total of 38,851 (+2.14%) patent applications were granted as patents during the first 6 months of 2016, of which 24,933 (+7.01%) were for invention patents, 9,901 (-11.07%) were for utility model patents, and 4,017 (+11.49%) were for design patents.
Between January 1 and June 30, 2016, the TIPO received 38,269 trademark applications, an increase of 1.50% compared to the same period last year. The number of applications by domestic applicants increased 0.32% to 27,684. There were 10,585 applications by foreign applicants, an increase of 4.72%. In terms of nationality, the mainland China ranked first with 2,169 applications, followed by the U.S. (1,904 applications), Japan (1,739 applications), South Korea (803 applications) and Hong Kong (739 applications).